Our Commitment to Technologies

Research & Development

Through the research and development of new materials, resin molding technologies, and microfabrication, we promote our core businesses and make forays into other fields.

We work on the research and development of new materials, resin molding technologies, and microfabrication to further improve the level of the mold-manufacturing and resin-molding technologies that we have developed over many years and to create innovative technology. Achievements made through these research and development efforts are applied not only to the semiconductor field but also to other fields such as optics, healthcare, biochemistry.

ポイント

  • Research and development of new materials with new functions with a focus on inorganic materials, including hybrids with metallic materials and organic materials
  • Development of resin molding technologies for responding to future changes in market demand
  • Broadening the fields of application by advancing our microfabrication technologies to the submicron level

New Materials Research

In the field of new materials, we undertake the research and development of new materials as the base materials of molds and surface treatment materials for molds, with a focus on inorganic materials including hybrids with metallic materials and organic materials.

For example, in the development of mold parts, after powder materials are molded by applying Cold Isostatic Pressing (CIP), they are calcinated in a multi-purpose high-temperature furnace or an atmosphere furnace, and with hard-to-machine materials, we make parts using ultrasonic assisted high-efficiency machining equipment.We constantly pursue new materials with new functions.

We believe that efforts for research and development of new materials can improve the durability of the mold parts themselves and contribute to the improvement of customer’s productivity.

Molding of a powder material with Cold Isostatic Pressing (CIP)

Molding of a powder material with Cold Isostatic Pressing (CIP)

Processing of hard-to-process material with ultrasonic assisted high-efficiency machining equipment

Processing of hard-to-process material with ultrasonic assisted high-efficiency machining equipment

 

Research of resin molding technologies

In the field of resin molding technologies, we undertake the research and development of next-generation technologies.

Semiconductor plastic encapsulation technology includes the transfer method and the compression method.
Among them, the compression method newly developed by our company has been highly valued for being applicable to miniaturization, ultra-thinning and high functionality of semiconductor packages. As devices diversify, depending on changes in the market needs, it will be necessary to develop completely new resin molding technologies in the future. By researching the next generation resin molding technologies, we will respond to the sophisticated needs for improving productivity, increasing the yields of products or materials, and reducing molding time.

One of our initiatives regarding resin molding technologies is research and development on mold surface treatment. The surface treatment using our own Bancera coating improves release properties and antifouling properties, enabling the cleaning cycle of molds to be extended. We also conduct research and development on atmospheric plasma surface modification, develop molds for evaluating mold release resistance and conduct quantitative evaluations of the effects of surface treatment and surface modification.

Surface treatment with Bancera Coating, which features superior release and antifouling properties

Surface treatment with Bancera Coating, which features superior release and antifouling properties

Surface modification with atmospheric pressure plasma

Surface modification with atmospheric pressure plasma

Quantitative evaluation undertaken by using a mold for evaluating mold release resistance

Quantitative evaluation undertaken by using a mold for evaluating mold release resistance

Microfabrication Research

Our processing technologies are ultra-precision microfabrication technologies which have exceeded the micron level and have reached the nanometer level.

In microfabrication research, we undertake the development of applied technologies, which use machining or etching and ultra-precision electroforming (EF), and research on processing difficult-to-cut materials with powder, etc., aiming for further technology evolution. In singulation systems, we are applying advanced ultra-precision processing technologies to blades for singulation of products, and developing higher precision cutting of substrates.

Our company aims to be a solution company with development capability that creates new functions which do not exist in the world and makes the impossible possible.

Our core technology that supports nano-level processing realizes three-dimensional complex fine shape processing, and it is implemented as key technology indispensable to semiconductor and other devices such as liquid crystal display and medical equipment. Among researches applied in a wide range of fields, one is our research on polymer micro electro mechanical systems (MEMS).

The polymer MEMS enables the production of devices with mechanisms that cannot be created with conventional silicon substrates or similar by using material such as acrylic and silicone rubber. At TOWA, we are working on the development of technologies for producing micro devices and microchannel chips with nanoimprint molds. It is expected to be applied in a large number of fields including optics, healthcare, and biochemistry, and its market is expected to grow.

Nanoimprint mold

Nanoimprint mold

A molded micro channel chip

A molded microchannel chip

The actuator in the micro channel chip and its movable portion (5μm)

The actuator in the microchannel chip and its movable part (5μm)

Product List

  • Molding Equipment

    TOWA is a leading company in the semiconductor molding equipment market. We offer equipment using our proven transfer molding method, and high quality / flow free compression molding method.

  • Singulation Equipment

    With our expertise in the field of singulation, high speed handling and image analysis technology, we offer high quality singulation equipment.

  • Ultra-Precision Molds

    As the leading company in resin sealing technologies for semiconductors and other electronic components, we at TOWA Corporation have supplied a number of ultra-precision molds to the market. These products have been highly acclaimed by customers.

  • THPL-CBN End Mill Series

    Developed by utilizing technologies cultivated through the manufacture of ultra-precision molds, CBN end mills from TOWA boast high precision, superior abrasion resistance, and a long life-span.

Relevant Information