Our Commitment to Technologies

Automation Design Technologies

High-speed and high-precision handling of a wide variety of materials

and products for achieving a high cycle and higher product quality

In the automation design of semiconductor manufacturing equipments, by handling materials and products with high speed and high precision, productivity and quality are improved. Our proprietary design automation technologies are used to better meet customers' demands for quality and delivery of replacement parts for each product type.

Automation Featuring Handling Methods optimized according to the Characteristics of Each Material or Product

For resin sealing in the semiconductor assembly process, materials are conveyed into the molding equipment, molded with resin, and products are removed from it. In a series of processes, not only high-speed and high-precision conveyance is required but also a wide variety of materials and different shapes of products are handled in the equipment, and the method of conveying them needs to be optimized according to their characteristics.
For example, there are differences due to thickness, size, and stiffness for the different types of materials such as metallic frames, substrates, and wafers, and there are differences in shape and weight of resins, such as tablet, granule, and liquid.With our high design capabilities, by selecting optimal handling mechanisms according to the characteristics of each material and product in each unit and automating the process inside the equipment from the setting of materials to removal of molded products, high cycle production and superior product quality are achieved.

In case of parts replacement of the equipment, it is necessary to design the replacement part each time according to the product type, but our company automates its design by parameterizing the replacement part using 3D CAD and responds to customer's request with flexible delivery time and design quality improvement.

Example of Automation Using Semiconductor Manufacturing Equipment

LCM1010

LCM1010

Descriptions of each unit

LCM1010 Internal layout

  • Loader
    A unit that chucks two workpieces of material (substrates), which were cut out one by one, and sets them in the mold.
  • Dispenser
    A unit that moves into the press and applies a specific amount of liquid resin into the mold after the material was set in it by the loader.
  • Press and mold
    A unit that molds the material by elevating the press and applying pressure after the material is set in the mold and the liquid resin is applied into it.
  • Unloader
    A unit that moves into the press, removes the molded product, and puts it into the offload.

LCM1010 Internal layout and operation

1. The loader sets the material in the mold.

1. The loader sets the material in the mold.

2. The liquid resin is applied by the dispenser.

2. The liquid resin is applied by the dispenser.

3. Molding starts and the next material is set on the loader.

3. Molding starts and the next material is set on the loader.

4. The unloader removes the molded products.

4. The unloader removes the molded products.

Automating the Design of Replacement Parts for Flexible Delivery and Quality Improvement

Design is necessary whenever a replacement part for a product type is requested. By parameterizing the replacement parts using 3D CAD, their design automation was realized . This design automation has enabled faster delivery to customers and design quality improvement.

Example of Design Automation

1.Load basic design

Acquire the work size and the mold parts information which is the basis of the design

2.Convert product design information

Acquire the necessary items from the product design information

3.Layout design

Comprehensively judge the unit specification and the positioning of the main parts to be dispersed

4.Unit design

Create the unit model based on the standard design, centering on the main parts determined by the layout design

5.Drawing output

Output the drawing of units of which design is completed

6.Form output

Output the form of units of which design is completed

1.Load basic design

Acquire the work size and the mold parts information which is the basis of the design

2.Convert product design information

Acquire the necessary items from the product design information

3.Layout design

Comprehensively judge the unit specification and the positioning of the main parts to be dispersed

4.Unit design

Create the unit model based on the standard design, centering on the main parts determined by the layout design

5.Drawing output

Output the drawing of units of which design is completed

6.Form output

Output the form of units of which design is completed

Product List

  • Molding Equipment

    TOWA is a leading company in the semiconductor molding equipment market. We offer equipment using our proven transfer molding method, and high quality / flow free compression molding method.

  • Singulation Equipment

    With our expertise in the field of singulation, high speed handling and image analysis technology, we offer high quality singulation equipment.

  • Ultra-Precision Molds

    As the leading company in resin sealing technologies for semiconductors and other electronic components, we at TOWA Corporation have supplied a number of ultra-precision molds to the market. These products have been highly acclaimed by customers.

  • THPL-CBN End Mill Series

    Developed by utilizing technologies cultivated through the manufacture of ultra-precision molds, CBN end mills from TOWA boast high precision, superior abrasion resistance, and a long life-span.

Relevant Information