FFT-Series

FFT1030G

FFT1030G

Compression Molding Equipment

  

Features

  • TOWA's proprietary compression molding method using granular resin
  • Full automatic equipment suitable for multi-product variable production
  • Corresponding to the wafer level molding (manual system)
  • Environmentally friendly equipment that generates no waste
For inquiries about products, click here.

FFT1030W

FFT1030W

Compression Molding Equipment

   

Features

  • TOWA's proprietary compression molding method that using liquid resins (silicone/epoxy)
  • Suitable for multi-product variable production such as LED package
  • Full automatic equipment capable of automatic substrate loading and automatic resin supply by dispenser unit
  • Corresponding to the wafer level molding (manual system)
  • Environmentally friendly equipment that generates no waste
For inquiries about products, click here.

Relevant Products/Services

Product Case

  • Finger Print Sensors

    Introduce our manfufacturing technology used for finger print sensors.

  • Head-up Display

    Introduce ultra precision element technologies that support the manufacturing of high quality and high precision optical parts used in head up displays.

  • Automotive Electronic Devices

    Introduces our molding technologies andequipment, which improves the reliability of ECUs and various automotive electronic devices.

Relevant Information