YPM-Series

YPM1180

YPM1180

Transfer Molding Equipment

  

Features

  • Transfer molding equipment compatible with large workpieces
  • Compatible with large, 100mm X 300mm substrates
  • Central pressure system (with a hold frame structure)
  • Compatible with side gate and top gate
  • Compatible with release films
  • Unique, compact, high-precision press mechanism
  • Capable of molding large LF with clamping capability of 180tons
  • Significantly reduced footprint despite its compatibility with large workpieces
For inquiries about products, click here.

YPM1120

Transfer Molding Equipment

  

Features

  • Compatible with upper & lower moving pin chase structure for automobile & power device
  • Compatible with wide range of substrate thickness
  • Compatible with large frame 100mm X 300mm
For inquiries about products, click here.

YPM1080-SP

YPM1080-SP

Transfer Molding Equipment

  

Features

  • A model exclusively for substrates
  • Simplified mold structure that permits easy conversion between different product types and cost reduction
  • Compatible with substrates with a wide range of thicknesses
  • Compatible with four modules
  • High UPH
  • Compatible with large, 100mm X 300mm substrates
  • Wide range of options that are compatible with various substrates and MUF
For inquiries about products, click here.

Relevant Products/Services

 

Product Case

  • Finger Print Sensors

    Introduce our manfufacturing technology used for finger print sensors.

  • Head-up Display

    Introduce ultra precision element technologies that support the manufacturing of high quality and high precision optical parts used in head up displays.

  • Automotive Electronic Devices

    Introduces our molding technologies andequipment, which improves the reliability of ECUs and various automotive electronic devices.

Relevant Information