YPM-Series
YPM1200
Transfer Molding Equipment
Features
- Transfer molding equipment compatible with large workpieces
- Compatible with large, 100mm X 300mm substrates
- 200ton high-output press for larger sizes
- Dual plunger and long tablet specifications are available for large resin volumes
- Equipped with a plunger dust collection mechanism for stable production
- Standardization of options that are frequently needed in lead frame production
- For inquiries about products, click here.
Transfer Molding Equipment
Features
- Transfer molding equipment compatible with large workpieces
- Compatible with large, 100mm X 300mm substrates
- Central pressure system (with a hold frame structure)
- Compatible with side gate and top gate
- Compatible with release films
- Unique, compact, high-precision press mechanism
- Capable of molding large LF with clamping capability of 180tons
- Significantly reduced footprint despite its compatibility with large workpieces
Transfer Molding Equipment
Features
- Compatible with upper & lower moving pin chase structure for automobile & power device
- Compatible with wide range of substrate thickness
- Compatible with large frame 100mm X 300mm
Transfer Molding Equipment
Features
- A model exclusively for substrates
- Simplified mold structure that permits easy conversion between different product types and cost reduction
- Compatible with substrates with a wide range of thicknesses
- Compatible with four modules
- High UPH
- Compatible with large, 100mm X 300mm substrates
- Wide range of options that are compatible with various substrates and MUF
Transfer Molding Equipment
Features
- A model exclusively for substrates
- Compatible with substrates with a wide range of thicknesses
- Wide range of options that are compatible with various substrates and MUF
- Compatible with embedded package & exposed die package
- Compatible with various package thickness
- For inquiries about products, click here.
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Product Case
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