Products

 

Together with molding equipment, singulation system is one of the core equipments for the post process of semiconductor manufacturing. We develop dicers as a main function of singulation systems, thereby providing the optimal method of singulation for each type of manufactured product. In addition, our singulated product handlers contribute to improving customers’ productivity with high throughput.

LSG-Series

 

LSG1040

LSG1040

LSG1040 is TOWA’s next-generation laser singulation system with TOWA’s original laser technology.
It provides high-speed, non-contact dry processing for high productivity and excellent cutting quality.
In addition to straight cutting, the LSG1040 can cut curved lines and complex package shapes, giving more flexibility in semiconductor package design. The water-free laser process also helps reduce environmental impact and supports efficient use of resources in manufacturing.
The LSG1040 is an advanced singulation solution that meets the growing needs of semiconductor packaging for applications such as wearable devices and many other electronic products.

 

FMS-Series

 

FMS4040 Tray offload type

FMS4040 Tray offload type

FMS3040 Ring offload type

FMS3040 Ring offload type

The FMS Series is a fully automatic singulation system that is capable of handling substrates ranging from 40mm X 150mm to 100mm X 300mm in size, which are used for semiconductor production in many cases.

TOWA original dicer unit makes it possible to cut semiconductors into pieces as small as 1.0mm X 1.0mm.

Dicer units from TOWA use twin-cut tables and twin spindles. In addition, our handler units come with a variable pitch mechanism for the pick and place unit. This ensures high-speed conveyance and stable storage, enabling UPH40,000.

Further, our singulation systems maintain optimal cutting precision by correcting highly warped molded products before cutting them and checking for the misalignment of products — which may be caused by their expansion, contraction, or deformation — with a camera while they are being cut, and correcting them. They also come with a built-in function for visual inspection of products, allowing customers to reduce the number of inspection processes.

 

FWC-Series

 

FWC1020

The FWC1020 is a fully automated system for correcting product warpages that occurs in the semiconductor manufacturing process.
It corrects product warpages with temperature-controlled heating and cooling units for samples with a maximum size of 300 mm (L) x 100 mm (W).
Handling errors and product defects can be reduced and productivity can be improved by correcting sample warpages.
Additionally, a cooling water circulation system is used as an environmentally friendly solution.

 

Product Case

  • Finger Print Sensors

    Introduce our manfufacturing technology used for finger print sensors.

  • Head-up Display

    Introduce ultra precision element technologies that support the manufacturing of high quality and high precision optical parts used in head up displays.

  • Automotive Electronic Devices

    Introduces our molding technologies andequipment, which improves the reliability of ECUs and various automotive electronic devices.

  • Floating image technology

    Introducing the floating image lens and various application examples based on our ultra-precision mold processing technology, EF technology, and injection molding technology.

Relevant Information