At TOWA, we develop dicers and handlers,
the main functions of singulation equipment.
At TOWA, we develop dicers and handlers,
the main functions of singulation equipment.
Together with molding equipment, singulation system is one of the core equipments for the post process of semiconductor manufacturing. We develop dicers as a main function of singulation systems, thereby providing the optimal method of singulation for each type of manufactured product. In addition, our singulated product handlers contribute to improving customers' productivity with high throughput.
FMS4040 Tray offload type
FMS3040 Ring offload type
The FMS Series is a fully automatic singulation system that is capable of handling substrates ranging from 40mm X 150mm to 100mm X 300mm in size, which are used for semiconductor production in many cases.
TOWA original dicer unit makes it possible to cut semiconductors into pieces as small as 1.0mm X 1.0mm.
Dicer units from TOWA use twin-cut tables and twin spindles. In addition, our handler units come with a variable pitch mechanism for the pick and place unit. This ensures high-speed conveyance and stable storage, enabling UPH40,000.
Further, our singulation systems maintain optimal cutting precision by correcting highly warped molded products before cutting them and checking for the misalignment of products -- which may be caused by their expansion, contraction, or deformation -- with a camera while they are being cut, and correcting them. They also come with a built-in function for visual inspection of products, allowing customers to reduce the number of inspection processes.
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