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Advanced Package
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Large Format Panel for Generative AI/IoT – |
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As demand for Generative AI and IoT grows, advanced packaging technologies such as 2.xD, 3D, and chiplets are drawing attention. Here, we introduce our diverse technologies and robust support system for molding and cutting of large-format panels. |
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MOLDING We introduce the molding techniques used in various packages, including application processors and communication modules for mobile devices, memory, as well as power semiconductors, IPMs, and ECUs for automotive applications. |
SINGULATION We introduce our diverse solutions for cutting individual pieces of various package sizes, high-precision cutting technology for mounting boards, and automation equipment for labor savings, all paired with our proprietary blades. |
LASER TOWA LASER FRONT Corporation will introduce laser-based processing technologies, including wafer marking, as well as cutting, trimming, and welding techniques. |
Large Format Panel for Generative AI/IoT –
Molding and Cutting Technology
As demand for Generative AI and IoT grows, advanced packaging technologies such as 2.xD, 3D, and chiplets are drawing attention. Here, we introduce our diverse technologies and robust support system for molding and cutting of large-format panels.
MOLDING
We introduce the molding techniques used in various packages, including application processors and communication modules for mobile devices, memory, as well as power semiconductors, IPMs, and ECUs for automotive applications.
SINGULATION
We introduce our diverse solutions for cutting individual pieces of various package sizes, high-precision cutting technology for mounting boards, and automation equipment for labor savings, all paired with our proprietary blades.
LASER
TOWA LASER FRONT Corporation will introduce laser-based processing technologies, including wafer marking, as well as cutting, trimming, and welding techniques.
