Represented by CASE, we introduce advanced technology which contributes to the evolution of electrification, autonomous driving and infotainment.
 Inside the booth, in addition to the power semiconductor and ECU, we propose optimal solution based on the leveraging extensive semiconductor packaging technology and experience by displaying advanced packaged mold sample such as 2.5D and Chiplet expected in autonomous driving system and connected cars.

SINGULATION

We introduce our diverse solutions for cutting individual pieces of various package sizes, high-precision cutting technology for mounting boards, and automation equipment for labor savings, all paired with our proprietary blades.

COATING

We introduce our original coating technology which enables super water repellent and infrared transmissive with excellent stain resistance and durability.

LASER

TOWA LASERFRONT CORPORATION offers diverse products and technology, from laser oscillator to processing equipment, in order to contribute to solving challenges related to various types of microprocessing in the automotive field.