At our booth, we will focus on the current trends for EVs, ADAS, and IoT,
and propose solutions utilizing our resin molding technology,
microfabrication technology, coating technology and laser technology.
We really hope you will have the opportunity to visit us.
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Date Time Location Booth Admission Fee |
January 24 (Wed.) to 26 (Fri.), 2024 10:00-17:00 Tokyo Big Sight East Bldg. Hall 5 No.E37-48 |
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Date |
January 24 (Wed.) to 26 (Fri.), 2024 |
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Time |
10:00-17:00 |
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Location |
Tokyo Big Sight East Bldg. |
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Booth |
Hall 5 No.E37-48 |
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Admission Fee |
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Molding Technology for Power Semiconductors (EV)
Introducing our molding technologies that help improve performance, reliability and enables further package miniaturization for modular devices such as power semiconductors and ECUs used in the evolution of the next generation environmentally friendly vehicles such as EVs. |
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Molding Technology for Sensors and Cameras (ADAS)
We support the evolution of automated driving by introducing optimal molding technologies for sensor/camera modules which enables cars to better recognize their surroundings in real time to make appropriate driving decisions. |
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Molding Technology for Advanced Packaging (IoT)
We contribute to making cars more multifunctional and the development of a smart mobility society with our molding technologies by realizing cutting-edge packages for advances in connectivity, 5G (mm wavelength), AI and deep learning. |
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Coating Technology
Introducing BANCERA® coating, a unique ceramic coating that dramatically improves mold release, stain resistance, and durability, contributing to improved product quality and productivity. |
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Ultra-precision Microfabrication Technology and EF (precision electroforming) Technology Introducing our ultra-precision microfabrication technology meeting accuracy processing demands for nano-level shapes. Furthermore, we introduce our EF (precision electroforming) technology that enables precise electroforming of large format sizes up to Φ1100mm, making it one of the best in Japan. |
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Laser Processing Technology
Introducing a wide range of products and technologies from laser oscillators to processing equipment that contribute to solving a wide variety of microfabrication issues in the automotive field. |
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 |
Molding Technology for Power Semiconductors (EV)
Introducing our molding technologies that help improve performance, reliability and enables further package miniaturization for modular devices such as power semiconductors and ECUs used in the evolution of the next generation environmentally friendly vehicles such as EVs. |
||
 |
Molding Technology for Sensors and Cameras (ADAS)
We support the evolution of automated driving by introducing optimal molding technologies for sensor/camera modules which enables cars to better recognize their surroundings in real time to make appropriate driving decisions. |
||
 |
Molding Technology for Advanced Packaging (IoT)
We contribute to making cars more multifunctional and the development of a smart mobility society with our molding technologies by realizing cutting-edge packages for advances in connectivity, 5G (mm wavelength), AI and deep learning. |
||
 |
Coating Technology
Introducing BANCERA® coating, a unique ceramic coating that dramatically improves mold release, stain resistance, and durability, contributing to improved product quality and productivity. |
||
 |
Ultra-precision Microfabrication Technology and EF (precision electroforming) Technology Introducing our ultra-precision microfabrication technology meeting accuracy processing demands for nano-level shapes. Furthermore, we introduce our EF (precision electroforming) technology that enables precise electroforming of large format sizes up to Φ1100mm, making it one of the best in Japan. |
||
 |
Laser Processing Technology
Introducing a wide range of products and technologies from laser oscillators to processing equipment that contribute to solving a wide variety of microfabrication issues in the automotive field. |
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Tokyo Big Sight East Bldg. Hall 5 No.E37-48
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